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碳化硅芯片
【中文】采用高可靠性平面栅技术,电压650V-1200V,单颗芯片电流能力最高50A。采用开尔文源极引脚与叠层低感设计,大幅降低模块寄生电感,高频开关性能优异,可靠性高,适用于高频电源等对效率要求严苛的场合。
【English】Using a highly reliable planar gate process, SiC MOSFET chips cover 650V-1200V with up to 50 A per die. Kelvin source pins and stacked low-inductance design greatly reduce module parasitic inductance, delivering strong high-frequency switching performance and reliability for demanding power supply applications.