功率半导体研发服务

【中文】覆盖芯片版图设计与仿真、流片工艺、功率芯片结构与工艺设计、封装设计与仿真及封装工艺制定、功率模块封装布局与优化、功率器件应用仿真（含芯片结温分布与输出能力评估），并延伸至电力电子设备软硬件开发，如光伏逆变器软件算法与高端定制化硬件设计。
【English】Services cover chip layout design and simulation, tape-out process definition, power chip structure and process design, package design, simulation and process engineering, power module layout optimization, and device application simulation including junction temperature distribution and output capability assessment, plus power electronics software and hardware development.